
AKTUELLE PARTNERANGEBOTE
Three Dimensional System Integration: IC Stacking Process and Design
Brand : Springer, Binding : Taschenbuch, Edition : 2011, Label : Springer, Publisher : Springer, medium : Taschenbuch, numberOfPages : 256, publicationDate : 2014-09-02, releaseDate : 2014-09-02, publishers : Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic, ISBN : 1489981829
1 Angebote · ab 53,49 € gemeldete Gesamtkosten
