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Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications

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Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications

Binding : Gebundene Ausgabe, Edition : 1st ed. 2015, Label : Springer, Publisher : Springer, PackageQuantity : 3, medium : Gebundene Ausgabe, numberOfPages : 408, publicationDate : 2015-12-16, publishers : Kazuo Kondo, Morihiro Kada, Kenji Takahashi, languages : english, ISBN : 3319186744

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