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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

Name: The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
Brand: Gerard Kelly
SKU: 7032509

Brand : Springer, Binding : Taschenbuch, Edition : 1999, Label : Springer, Publisher : Springer, medium : Taschenbuch, numberOfPages : 160, publicationDate : 2014-04-30, releaseDate : 2014-04-30, authors : Gerard Kelly, ISBN : 1461372763

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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages