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Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development

Name: Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development
Brand: Way Kuo
SKU: 12221140

Brand : Springer, Binding : Gebundene Ausgabe, Edition : 1998, Label : Springer, Publisher : Springer, NumberOfItems : 1, PackageQuantity : 1, Format : Illustriert, medium : Gebundene Ausgabe, numberOfPages : 420, publicationDate : 1998-01-31, releaseDate : 1998-01-31, authors : Way Kuo, Wei-Ting Kary Chien, Taeho Kim, ISBN : 0792381076

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Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development