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Hybrid Bonding Advanced Substrates Failure Mechanisms and Thermal Management for Chiplets and Heterogeneous Integration

Name: Hybrid Bonding Advanced Substrates Failure Mechanisms and Thermal Management for Chiplets and Heterogeneous Integration
Brand: Springer
SKU: 8570708

Hybrid Bonding Advanced Substrates Failure Mechanisms and Thermal Management for Chiplets and Heterogeneous Integration. John Lau/ Xuejun Fan. Taschenbuch. Taschenbuch

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Hybrid Bonding Advanced Substrates Failure Mechanisms and Thermal Management for Chiplets and Heterogeneous Integration