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High-Frequency Characterization of Electronic Packaging (Electronic Packaging and Interconnects) (Electronic Packaging and Interconnects, 1, Band 1)

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High-Frequency Characterization of Electronic Packaging (Electronic Packaging and Interconnects) (Electronic Packaging and Interconnects, 1, Band 1)

Brand : Springer, Binding : Taschenbuch, Edition : Softcover reprint of the original 1st ed. 1998, Label : Springer, Publisher : Springer, medium : Taschenbuch, numberOfPages : 176, publicationDate : 2014-09-12, releaseDate : 2014-09-12, authors : Luc Martens, ISBN : 1461375738

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