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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys (The Springer International Series in Engineering and Computer Science, 719, Band 719)

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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys (The Springer International Series in Engineering and Computer Science, 719, Band 719)

Brand : Springer, Binding : Taschenbuch, Edition : Softcover reprint of the original 1st ed. 2003, Label : Springer, Publisher : Springer, medium : Taschenbuch, numberOfPages : 208, publicationDate : 2002-12-31, releaseDate : 2002-12-31, authors : Erdogan Madenci, ISBN : 1461349893

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