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Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability

Name: Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability
Brand: Siow, Kim S.
SKU: 3590829

Brand : Springer-Verlag GmbH, Binding : Gebundene Ausgabe, Edition : 1st ed. 2019, Label : Springer, Publisher : Springer, medium : Gebundene Ausgabe, numberOfPages : 279, publicationDate : 2019-02-07, publishers : Siow, Kim S., ISBN : 3319992554

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Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability

Finde das Produkt,
das wirklich zu dir passt.