Direkt zum Inhalt
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

AKTUELLE PARTNERANGEBOTE

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

Brand : Springer, Binding : Taschenbuch, Edition : 2000, Label : Springer, Publisher : Springer, medium : Taschenbuch, numberOfPages : 208, publicationDate : 2013-10-04, releaseDate : 2013-10-04, authors : G.Q. Zhang, ISBN : 1441948732

1 Angebote · ab 101,64 € gemeldete Gesamtkosten