
AKTUELLE PARTNERANGEBOTE
Assembly and Reliability of Lead-Free Solder Joints
Binding : Taschenbuch, Edition : 1st ed. 2020, Label : Springer, Publisher : Springer, medium : Taschenbuch, numberOfPages : 548, publicationDate : 2021-05-30, releaseDate : 2021-05-30, authors : Lau, John H., Ning-Cheng Lee, ISBN : 9811539227
2 Angebote · ab 115,84 € gemeldete Gesamtkosten
