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Advanced Materials for Thermal Management of Electronic Packaging (Springer Series in Advanced Microelectronics, 30, Band 30)

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Advanced Materials for Thermal Management of Electronic Packaging (Springer Series in Advanced Microelectronics, 30, Band 30)

Brand : Springer, Binding : Taschenbuch, Edition : 2011, Label : Springer, Publisher : Springer, medium : Taschenbuch, numberOfPages : 640, publicationDate : 2013-02-25, releaseDate : 2013-02-25, authors : Tong, Xingcun Colin, ISBN : 1461427924

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